BUILD TO PRINT MANUFACTURING, ASSEMBLE, TEST, RADIATION TESTING AND CIRCUIT DESIGN OF SEMICONDUCTORS FOR CLASS B AND S LEVELS. MCM & HYBRIDS.

custom microelectronics, microelectronics packaging, integrated circuits packaging, ic packaging, multi chip modules, mcm, hybrids, mil spec testing, class s, class b, hi-rel, die processing, die attach, wire bonding, mil std 883, hermetic, environmental screening, electrical testing, obsolete microcircuits, obsolete parts, surface mount modules, memory modules, military, space, burn-in, burnin, burn in, testing, iso 9000, chip, microchip, custom package design, custom parts engineering

sac-tec: custom microelectronics, hi -rel, military and space components, multi chip modules (mcm). testing to military specifications. obsolete die and components specialist.