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SLAC National Accelerator Laboratory is operated by Stanford University for the Department of Energy. As a management and operating contractor, subcontracts awarded by the Laboratory are not Federal procurements, and are not directly subject to the Federal Acquisition Regulations in 48 CFR. Nonetheless, certain Federal laws, Executive Orders, and regulations may affect our DOE approved purchasing system, as required by statute, regulation, or contract terms and conditions.

SLAC has a requirement for a U.S. domestic end item source of the following:

1. Processing of ROC Wafers:
   
   
   
   1. Preparation of full wafer ROC bumping design (10 bumps, mechanical bumps, alignment marks)
   
   
   2. Fabrication of one 9" ROC wafer bumping lithography glass mask (external vendor)
   
   
   3. Batch start and provision of process setup wafer
   
   
   4. Sputter deposition of the plating base TiW/Cu
   
   
   5. Lithography of the resist layer
   
   
   6. Electroplating of UBM (Cu) and SnAg bumps (leadfree)
   
   
   7. Stripping of resist and plating base
   
   
   8. Reflow of bumps (final bump height approx. 25µm)
   
   
   9. Automated bump inspection (100%, only KGD will be used for flip chip assembly)
   
   
   10. Dicing of wafer into dice
   
   
   11. Cleaning, inspection, and sorting
   
   
   
   


2. Processing of Sensor Wafers (ICS Sensor, 115µm thickness, thin entrance window)
   
   
   
   1. Preparation of sensor wafer UBM design (10 UBM pads, mechanical UBM pads, alignment marks)
   
   
   2. Fabrication of one 9" ROC wafer bumping lithography glass mask (external vendor)
   
   
   3. Batch start and procision of process setup wafer
   
   
   4. Water bonding onto temporary carrier
   
   
   5. Sputter deposition of the plating base TiW/Cu
   
   
   6. Lithography of the resist layer
   
   
   7. Electroplating of UBM (Cu) and SnAg bumps (leadfree)
   
   
   8. Stripping of resist and plating base
   
   
   9. UBM inspections
   
   
   10. Temporary carrier de-bonding and wafer cleaning
   
   
   11. Dicing of wafer into dice
   
   
   12. Cleaning, inspection, and sorting
   
   
   
   


3. Assembly of hybrid modubles:
   
   
   
   1. Inspection and preparation of sensors and ROCs for assembly
   
   
   2. Setup of assembly process (test assemblies and bond result analysis using spare parts)
   
   
   3. Flip chip attach of ROC to sensor modules:
      
      
      
      1. 120 of 1x1 modules
      
      
      
      
   
   
   4. Reflow of module in batch oven
   
   
   5. X-ray inspection of every module (100% chip overview and corners)
   
   
   6. Shipment of all modules and remaining wafer part back to SLAC
   
   
   
   

The award will be made based upon the Lowest Price Technically Acceptable method. All proposals must meet the SOW specifications.

Marking of Proprietary/Confidential Information. Offerors shall properly mark and identify with a restrictive legend or information markings on pages of the proposal that contain Proprietary/confidential information.

For Offeror to be eligible for a subcontract award with the University and the U.S. Department of Energy (DOE), Offeror shall be registered with the System for Award Management (SAM). Entities may register at no cost directly at the SAM website: https://www.sam.gov.

The resulting purchase order shall be performed in accordance with SLAC National Accelerator Laboratory's Terms and Conditions for Fixed Price Commercial Supplies and Services dated November 2022.

NOTE: The following documents are attached in this solicitation.

1. Buy American Act Certificate


2. Terms & Conditions for Fixed Price Commercial Supplies and Services, November 2022


3. SLAC Req-334510-SOW-v1


4. GFP

Please provide quoted price, delivery, technical compliance statement and certification to the attention of Angela Garcia.

Payment Terms: Net 30 days

Freight terms: FOB Destination Prepaid and Add or DAP

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