Active

Contract Opportunity

Opportunity:

Lawrence Livermore National Laboratory (LLNL), operated by the Lawrence Livermore National Security (LLNS), LLC under contract no. DE-AC52-07NA27344 (Contract 44) with the U.S. Department of Energy (DOE), is offering the opportunity to enter into a collaboration to commercialize its innovative cooling method for high power devices.

Background:

The drive for higher performance has led to greater integration in next generation integrated circuits (IC). Due to the miniaturization of semiconductor chips, there is a continuing need to dissipate heat in these devices. These thermal effects have a significant impact on device performance and reliability. Effective cooling of electronics is a requirement for these chips to be faster, better, and cheaper. Most of the current research center on fluid-based active cooling while this novel technology cools the device without the use of fluids.

Description:

For cooling a high power device, the novel approach is to use a thermoelectric cooler (TEC)-based embedded substrate with proper selection of the TEC material as an active cooler. The packaging configuration of TEC allows cooling the entire die without the use of a fluid. The process is compatible with the thin film TEC material. Standard semiconductor processes can be used to manufacture the IC.

This technology was developed to work on laser diodes, specifically those with a low-pitch stack, but it can also be made to work for other high-power devices.

Advantages/Benefits:

• The technology is a compact, non-fluid-based cooling system. For stacked diodes with lower pitch, the technology allows for increased laser brightness


• The technology is compatible with standard semiconductor manufacturing processes while also reducing manufacturing costs.

Potential Applications:

• Active cooling of high-power devices


• TEC cooling

Development Status:

LLNL has filed for patent protection on this invention:

U.S. Patent Application No. 18/155,503 Systems and Methods for Cooling High Power Devices filed 01/17/2023

Current stage of technology development: TRL 2

LLNL is seeking industry partners with a demonstrated ability to bring such inventions to the market. Moving critical technology beyond the Laboratory to the commercial world helps our licensees gain a competitive edge in the marketplace. All licensing activities are conducted under policies relating to the strict nondisclosure of company proprietary information.

Please visit the IPO website at https://ipo.llnl.gov/resources for more information on working with LLNL and the industrial partnering and technology transfer process.

Note: THIS IS NOT A PROCUREMENT. Companies interested in commercializing LLNL's Innovative Approach to High Power Devices Cooling should provide a written statement of interest, which includes the following:

1. Company Name and address.

2. The name, address, and telephone number of a point of contact.

3. A description of corporate expertise and/or facilities relevant to commercializing this technology.

Written responses should be directed to:

Lawrence Livermore National Laboratory

Innovation and Partnerships Office

P.O. Box 808, L-779

Livermore, CA 94551-0808

Attention: IL-13776/TB525-23

Please provide your written statement within thirty (30) days from the date this announcement is published to ensure consideration of your interest in LLNL's Innovative Approach to High Power Devices Cooling.

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