Flip Chip Bonder with Installation
| Agency: | ENERGY, DEPARTMENT OF |
|---|---|
| Level of Government: | Federal |
| Category: |
|
| Opps ID: | NBD00159208797389448 |
| Posted Date: | Nov 3, 2022 |
| Due Date: | Nov 11, 2022 |
| Solicitation No: | AA-2023-01 |
| Source: | https://sam.gov/opp/d6b387f535... |
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- Contract Opportunity Type: Sources Sought (Original)
- All Dates/Times are: (UTC-07:00) PACIFIC STANDARD TIME, LOS ANGELES, USA
- Original Published Date: Nov 03, 2022 11:24 am PDT
- Original Response Date: Nov 11, 2022 03:00 pm PST
- Inactive Policy: 15 days after response date
- Original Inactive Date:
-
Initiative:
- None
- Original Set Aside:
- Product Service Code:
-
NAICS Code:
- 334516 - Analytical Laboratory Instrument Manufacturing
-
Place of Performance:
Berkeley , CA 94720USA
The University of California, Lawrence Berkeley National Laboratory is conducting market research to identify potential sources that possess the expertise, capabilities, and experience necessary to supply and install a flip chip bonder. Please see the attached RFI document for details and instructions.
- 1 Cyclotron Rd
- Berkeley , CA 94720
- USA
- Arielle Anoop
- aanoop@lbl.gov
- Phone Number 5104865519
- Nov 03, 2022 11:24 am PDTSources Sought (Original)
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